GOLD

 

PROPERTY

@ 300K

UNITS

REFERENCES

Density

19.3

G/cm3

Au1  Au2  Au3

Specific Heat

0.03088

Cal/g-K

Au4  Au5  Au6

Thermal Conductivity

0.753

Cal/cm-s-K

Au7  Au8  Au9

Thermal Exp Coef    

14.2x10-6

1/K

Au10  Au11  Au12

Melting Point

1337.58

K

Au13

Resistivity                1

2.249x10-6

Ohm-cm

Au14  Au15  Au16

TCR   (218K to 398K)

3670

Ppm/K

Au14  Au15  Au16

Young’s Modulus     

1.12x107

psi

Au17  Au18  Au19

Poisson’s Ratio

0.425

-----

Au17  Au18  Au20

Yield Strength

250

psi

Au21  Au24  Au27

Ult Tensile strength

17,000

psi

Au21  Au22  Au23

Elongation at Break

50

%

Au21  Au22  Au23

Hardness

18.5

Brinell

Au23  Au25  Au26

 

1: The resistivity of sputtered gold films onto bismuth oxide shows resistivities in the range of 7 to 16 micro ohm-cm. Resistivity is dependent on thickness and substrate temperature. Annealed films with thickness > 200 angstroms deposited on substrates held at –183C provides resistivities nearest the bulk values.

 

Mechanical properties listed are for fully annealed, bulk material. 60% cold work producing 0.05 inch dia wire will increase strength to 30,000 psi and decrease elongation to 4%. [Au30] polycrystalline films demonstrate strengths on the order of 70,000 psi with 2 to 3% elongation. [Au29] Heating cold worked material above 150C causes recovery and recrystalization erasing the effects of cold work.

 

The mechanical properties for very thin wires differ considerably from the values listed above. Recent work indicates room temperature properties for 0.001 inch(25 micron) wire are: yield strength = 25,000 psi; tensile strength = 30,000 psi; elongation = 4%. [Au30]

 


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Revised: April 17, 2004